Renesas RMLV0816BGSD-4S2#HC0 Memory Integrated Circuit
IC SRAM 8MBIT PARALLEL 52TSOP II
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
RMLV0816BGSD-4S2#HC0
Detailed Description
Package
52-TFSOP (0.350", 8.89mm Width)
Key Features
Package / Case: 52-TFSOP (0.350", 8.89mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
RMLV0816BGSD-4S2#HC0 Datasheet
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Technical Specifications
Renesas RMLV0816BGSD-4S2#HC0 Memory Integrated Circuit technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
52-TFSOP (0.350", 8.89mm Width)
Technology
SRAM
Supplier Device Package
52-TSOP II
Memory Size
8Mb (1M x 8, 512K x 16)
Memory Type
Volatile
Supply Voltage
2.4V ~ 3.6V
Access Time
45 ns
Memory Format
SRAM
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