Renesas R7FA6M5AG2CBG#AC0 Microcontroller, Microprocessor, FPGA Modules
MCU RA6 ARM CM33 200MHZ 1.5M/512
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7FA6M5AG2CBG#AC0
Detailed Description
Package
176-LFBGA
Key Features
Package / Case: 176-LFBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
R7FA6M5AG2CBG#AC0 Datasheet
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Technical Specifications
Renesas R7FA6M5AG2CBG#AC0 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
176-LFBGA
Supplier Device Package
176-LFBGA (13x13)
Peripherals
DMA, LVD, POR, PWM, WDT
Number of I/O
133
Speed
200MHz
EEPROM Size
8K x 8
Core Processor
ARM® Cortex®-M33
RAM Size
512K x 8
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