Renesas R7FA6E2BB3CNH#BA0 Microcontroller, Microprocessor, FPGA Modules
MCU:RA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7FA6E2BB3CNH#BA0
Detailed Description
Package
32-WFQFN Exposed Pad
Key Features
Package / Case: 32-WFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
R7FA6E2BB3CNH#BA0 Datasheet
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Technical Specifications
Renesas R7FA6E2BB3CNH#BA0 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
32-WFQFN Exposed Pad
Supplier Device Package
32-HWQFN (5x5)
Peripherals
DMA, LVD, POR, PWM, WDT
Number of I/O
16
Speed
200MHz
EEPROM Size
4K x 8
Core Processor
ARM® Cortex®-M33
RAM Size
40K x 8
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