Renesas R7FA2E2A72DBY#HC1 Microcontroller, Microprocessor, FPGA Modules
RA2E2 GROUP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7FA2E2A72DBY#HC1
Detailed Description
Package
16-UFBGA, WLCSP
Key Features
Package / Case: 16-UFBGA, WLCSP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
R7FA2E2A72DBY#HC1 Datasheet
Quick Jump:
Technical Specifications
Renesas R7FA2E2A72DBY#HC1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
16-UFBGA, WLCSP
Peripherals
DMA, LVD, POR, PWM, WDT
Number of I/O
12
Speed
48MHz
EEPROM Size
2K x 8
Core Processor
ARM® Cortex®-M23
RAM Size
8K x 8
Program Memory Type
Flash
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.