Renesas R7F7016534ABG-C#AC1 Microcontroller, Microprocessor, FPGA Modules
32BIT MCU RH850/F1KM-PREMIUM SC2
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7F7016534ABG-C#AC1
Detailed Description
Package
272-FBGA
Key Features
Package / Case: 272-FBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
R7F7016534ABG-C#AC1 Datasheet
Quick Jump:
Technical Specifications
Renesas R7F7016534ABG-C#AC1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
272-FBGA
Supplier Device Package
272-FBGA (17x17)
Peripherals
DMA, LVD, PWM, WDT
Number of I/O
214
Speed
240MHz
EEPROM Size
128K x 8
Core Processor
RH850G3KH
RAM Size
512K x 8
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.