Renesas R7F701428EABG-C#BC1 Microcontroller, Microprocessor, FPGA Modules
32BIT MCU RH850/D1M2 376BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7F701428EABG-C#BC1
Detailed Description
Package
376-BGA
Key Features
Package / Case: 376-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
R7F701428EABG-C#BC1 Datasheet
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Technical Specifications
Renesas R7F701428EABG-C#BC1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 150°C (TJ)
Mounting Type
Surface Mount
Package / Case
376-BGA
Supplier Device Package
376-BGA (23x23)
Peripherals
DMA, I²S, LCD, LVD, POR, PWM, WDT
Speed
240MHz
EEPROM Size
64K x 8
Core Processor
RH850G3M
RAM Size
3.6M x 8
Program Memory Type
Flash
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