Renesas R7F0E016D2DBN#HA1 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 1.5MB FLSH 156WLBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7F0E016D2DBN#HA1
Detailed Description
Package
156-XFBGA
Key Features
Package / Case: 156-XFBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
R7F0E016D2DBN#HA1 Datasheet
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Technical Specifications
Renesas R7F0E016D2DBN#HA1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
156-XFBGA
Supplier Device Package
156-WLBGA (4.47x4.27)
Peripherals
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O
102
Speed
24MHz
Core Processor
ARM® Cortex®-M0+
RAM Size
256K x 8
Program Memory Type
Flash
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