Renesas R5F1026AGSP#55 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 16KB FLASH 20LSSOP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R5F1026AGSP#55
Detailed Description
Package
20-LSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 20-LSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
R5F1026AGSP#55 Datasheet
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Technical Specifications
Renesas R5F1026AGSP#55 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
20-LSSOP (0.173", 4.40mm Width)
Supplier Device Package
20-LSSOP
Peripherals
DMA, LVD, POR, PWM, WDT
Number of I/O
14
Speed
24MHz
EEPROM Size
2K x 8
Core Processor
RL78
RAM Size
1.5K x 8
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