Renesas HC5513BIM Telecom
IC TELECOM INTERFACE 22DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
HC5513BIM
Detailed Description
IC TELECOM INTERFACE 22DIP
Package
22-DIP (0.400", 10.16mm)
Key Features
Package / Case: 22-DIP (0.400", 10.16mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
HC5513BIM Datasheet
Quick Jump:
Technical Specifications
Renesas HC5513BIM Telecom technical specifications.
General
Package / Case
22-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C
Current Supply
2.25mA
Number of Circuits
1
Power Watts
1.5 W
Function
Subscriber Line Interface Concept (SLIC)
Alternate Parts Comparison (HC5513BIM vs HC55185CIMZ96 vs HC5515CMZ vs HC5549CMZ)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 22-DIP | 28-LCC | 28-LCC | 28-LCC |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | 0°C ~ 70°C | 0°C ~ 70°C |
| Number of Circuits | 1 | 1 | 1 | 1 |
| Function | Subscriber Line Interface Concept (SLIC) | -- | Subscriber Line Interface Concept (SLIC) | Subscriber Line Interface Concept (SLIC) |
| Power Watts | 1.5 W | -- | 1.5 W | 35 mW |
| Action |
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