Renesas HC5513BIM Telecom
IC TELECOM INTERFACE 22DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
HC5513BIM
Detailed Description
Package
22-DIP (0.400", 10.16mm)
Key Features
Package / Case: 22-DIP (0.400", 10.16mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
HC5513BIM Datasheet
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Technical Specifications
Renesas HC5513BIM Telecom technical specifications.
General
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
22-DIP (0.400", 10.16mm)
Current Supply
2.25mA
Supplier Device Package
22-PDIP
Number of Circuits
1
Power Watts
1.5 W
Function
Subscriber Line Interface Concept (SLIC)
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