onsemi AX8052F100-3-WD1 Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 64KB FLASH WAFER
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
AX8052F100-3-WD1
Detailed Description
Package
Die
Key Features
Package / Case: Die; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
AX8052F100-3-WD1 Datasheet
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Technical Specifications
onsemi AX8052F100-3-WD1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
Die
Supplier Device Package
Wafer
Peripherals
Brown-out Detect/Reset, Crypto - AES, DMA, POR, PWM, TRNG, WDT
Number of I/O
24
Speed
20 MIPS
Core Processor
8052
RAM Size
8.25K x 8
Program Memory Type
Flash
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