NXP Semiconductors SPC5775BDK3MME2R Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 4MB FLASH 416MAPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
SPC5775BDK3MME2R
Detailed Description
Package
416-BGA
Key Features
Package / Case: 416-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
SPC5775BDK3MME2R Datasheet
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Technical Specifications
NXP Semiconductors SPC5775BDK3MME2R Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
416-BGA
Supplier Device Package
416-MAPBGA (27x27)
Peripherals
DMA, LVD, POR, Zipwire
Speed
220MHz
Core Processor
e200z7
RAM Size
512K x 8
Program Memory Type
Flash
Core Size
32-Bit Dual-Core
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