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NXP Semiconductors SPC5668GK0MMGR Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 2MB FLASH 208MAPBGA

10,860 ActiveNXP Semiconductors208-BGARoHS
SPC5668GK0MMGR - No Image Available

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SPC5668GK0MMGR
Manufacturer
Part Number (MPN)
SPC5668GK0MMGR
Detailed Description
IC MCU 32BIT 2MB FLASH 208MAPBGA
Package
208-BGA
Key Features
Package / Case: 208-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF SPC5668GK0MMGR Datasheet
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Technical Specifications

NXP Semiconductors SPC5668GK0MMGR Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
592K x 8
Package / Case
208-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3V ~ 5.5V
Peripherals
DMA, POR, PWM, WDT
Number of I/O
155
Speed
116MHz
Core Processor
e200z650
Program Memory Type
Flash

Alternate Parts Comparison (SPC5668GK0MMGR vs SPC5644AF0MMG2R vs SPC5644AF0MMG3 vs SPC5534MVM80)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case208-BGA208-BGA208-BGA208-BGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C-40°C ~ 125°C (TA)
Supply Voltage3V ~ 5.5V1.14V ~ 5.25V1.14V ~ 1.32V1.35V ~ 1.65V
Core Processore200z650e200z4e200z4e200z6
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size592K x 8192K x 8192K x 864K x 8
ConnectivityCANbus, Ethernet, I²C, LINbus, SCI, SPICANbus, EBI/EMI, LINbus, SCI, SPICANbus, EBI/EMI, LINbus, SCI, SPICANbus, EBI/EMI, Ethernet, SCI, SPI
Data ConvertersA/D 36x10bA/D 40x12bA/D 40x12bA/D 34x12b
Number of I/O155120120192
Oscillator TypeInternalInternalInternalExternal
PeripheralsDMA, POR, PWM, WDTDMA, POR, PWM, WDTDMA, POR, PWM, WDTDMA, POR, PWM, WDT
Action

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