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NXP Semiconductors SPC5644AF0MMG3 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 4MB FLASH 208MAPBGA

40,633 ActiveNXP Semiconductors208-BGARoHS
SPC5644AF0MMG3 - No Image Available

Same model may have multiple batches, images only for reference.

SPC5644AF0MMG3
Manufacturer
Part Number (MPN)
SPC5644AF0MMG3
Detailed Description
IC MCU 32BIT 4MB FLASH 208MAPBGA
Package
208-BGA
Key Features
Package / Case: 208-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF SPC5644AF0MMG3 Datasheet
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Technical Specifications

NXP Semiconductors SPC5644AF0MMG3 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
192K x 8
Package / Case
208-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
1.14V ~ 1.32V
Peripherals
DMA, POR, PWM, WDT
Number of I/O
120
Speed
80MHz
Core Processor
e200z4
Program Memory Type
Flash

Alternate Parts Comparison (SPC5644AF0MMG3 vs SPC5644AF0MMG2R vs SPC5534MVM80 vs SPC5668GK0MMGR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case208-BGA208-BGA208-BGA208-BGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage1.14V ~ 1.32V1.14V ~ 5.25V1.35V ~ 1.65V3V ~ 5.5V
Core Processore200z4e200z4e200z6e200z650
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size192K x 8192K x 864K x 8592K x 8
ConnectivityCANbus, EBI/EMI, LINbus, SCI, SPICANbus, EBI/EMI, LINbus, SCI, SPICANbus, EBI/EMI, Ethernet, SCI, SPICANbus, Ethernet, I²C, LINbus, SCI, SPI
Data ConvertersA/D 40x12bA/D 40x12bA/D 34x12bA/D 36x10b
Number of I/O120120192155
Oscillator TypeInternalInternalExternalInternal
PeripheralsDMA, POR, PWM, WDTDMA, POR, PWM, WDTDMA, POR, PWM, WDTDMA, POR, PWM, WDT
Action

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