NXP Semiconductors MC9S12XEP100CVL Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 1MB FLASH 208MAPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S12XEP100CVL
Detailed Description
Package
208-BGA
Key Features
Package / Case: 208-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MC9S12XEP100CVL Datasheet
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Technical Specifications
NXP Semiconductors MC9S12XEP100CVL Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
208-BGA
Supplier Device Package
208-BGA (17x17)
Peripherals
LVD, POR, PWM, WDT
Number of I/O
152
Speed
50MHz
EEPROM Size
4K x 8
Core Processor
HCS12X
RAM Size
64K x 8
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