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NXP Semiconductors SPC5642AF2MVZ3 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 2MB FLASH 324PBGA

1,830 ActiveNXP Semiconductors324-BBGARoHS
SPC5642AF2MVZ3 - No Image Available

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SPC5642AF2MVZ3
Manufacturer
Part Number (MPN)
SPC5642AF2MVZ3
Detailed Description
IC MCU 32BIT 2MB FLASH 324PBGA
Package
324-BBGA
Key Features
Package / Case: 324-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF SPC5642AF2MVZ3 Datasheet
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Technical Specifications

NXP Semiconductors SPC5642AF2MVZ3 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
128K x 8
Package / Case
324-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
1.14V ~ 5.25V
Peripherals
DMA, POR, PWM, WDT
Number of I/O
151
Speed
80MHz
Core Processor
e200z4
Program Memory Type
Flash

Alternate Parts Comparison (SPC5642AF2MVZ3 vs SPC5125YVN400 vs SPC5644AF0MVZ1 vs SPC5643AF0MVZ2)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case324-BBGA324-BBGA324-BBGA324-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage1.14V ~ 5.25V1.08V ~ 3.6V1.14V ~ 5.25V1.14V ~ 5.25V
Core Processore200z4e300e200z4e200z4
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size128K x 832K x 8192K x 8192K x 8
ConnectivityCANbus, EBI/EMI, LINbus, SCI, SPICANbus, EBI/EMI, Ethernet, I²C, USB OTGCANbus, EBI/EMI, LINbus, SCI, SPICANbus, EBI/EMI, LINbus, SCI, SPI
Number of I/O15164151151
Oscillator TypeInternalExternalInternalInternal
PeripheralsDMA, POR, PWM, WDTDMA, WDTDMA, POR, PWM, WDTDMA, POR, PWM, WDT
Program Memory TypeFlashROMlessFlashFlash
Action

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