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NXP Semiconductors SPC5125YVN400 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT ROMLESS 324PBGA

1,917 ActiveNXP Semiconductors324-BBGARoHS
SPC5125YVN400 - No Image Available

Same model may have multiple batches, images only for reference.

SPC5125YVN400
Manufacturer
Part Number (MPN)
SPC5125YVN400
Detailed Description
IC MCU 32BIT ROMLESS 324PBGA
Package
324-BBGA
Key Features
Package / Case: 324-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF SPC5125YVN400 Datasheet
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Technical Specifications

NXP Semiconductors SPC5125YVN400 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
32K x 8
Package / Case
324-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
1.08V ~ 3.6V
Peripherals
DMA, WDT
Number of I/O
64
Speed
400MHz
Core Processor
e300
Program Memory Type
ROMless

Alternate Parts Comparison (SPC5125YVN400 vs SPC5644AF0MVZ1 vs SPC5643AF0MVZ2 vs SPC5534MVZ80)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case324-BBGA324-BBGA324-BBGA324-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage1.08V ~ 3.6V1.14V ~ 5.25V1.14V ~ 5.25V1.35V ~ 1.65V
Core Processore300e200z4e200z4e200z6
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size32K x 8192K x 8192K x 864K x 8
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, USB OTGCANbus, EBI/EMI, LINbus, SCI, SPICANbus, EBI/EMI, LINbus, SCI, SPICANbus, EBI/EMI, Ethernet, SCI, SPI
Number of I/O64151151220
Oscillator TypeExternalInternalInternalExternal
PeripheralsDMA, WDTDMA, POR, PWM, WDTDMA, POR, PWM, WDTDMA, POR, PWM, WDT
Program Memory TypeROMlessFlashFlashFlash
Action

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