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NXP Semiconductors MPC5553MZQ132 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 1.5MB FLASH 324PBGA

1,443 ActiveNXP Semiconductors324-BBGARoHS
MPC5553MZQ132 - No Image Available

Same model may have multiple batches, images only for reference.

MPC5553MZQ132
Manufacturer
Part Number (MPN)
MPC5553MZQ132
Detailed Description
IC MCU 32BIT 1.5MB FLASH 324PBGA
Package
324-BBGA
Key Features
Package / Case: 324-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MPC5553MZQ132 Datasheet
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Technical Specifications

NXP Semiconductors MPC5553MZQ132 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
64K x 8
Package / Case
324-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
1.35V ~ 1.65V
Peripherals
DMA, POR, PWM, WDT
Number of I/O
220
Speed
132MHz
Core Processor
e200z6
Program Memory Type
Flash

Alternate Parts Comparison (MPC5553MZQ132 vs MPC5125YVN400 vs MPC5534MZQ80 vs SPC5125YVN400)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case324-BBGA324-BBGA324-BBGA324-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TJ)-40°C ~ 125°C (TA)-40°C ~ 125°C
Supply Voltage1.35V ~ 1.65V1.08V ~ 3.6V1.35V ~ 1.65V1.08V ~ 3.6V
Core Processore200z6e300e200z6e300
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size64K x 832K x 864K x 832K x 8
ConnectivityCANbus, EBI/EMI, Ethernet, SCI, SPICANbus, EBI/EMI, Ethernet, I²C, USB OTGCANbus, EBI/EMI, Ethernet, SCI, SPICANbus, EBI/EMI, Ethernet, I²C, USB OTG
Number of I/O2206419264
Oscillator TypeExternalExternalExternalExternal
PeripheralsDMA, POR, PWM, WDTDMA, WDTDMA, POR, PWM, WDTDMA, WDT
Program Memory TypeFlashROMlessFlashROMless
Action

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