NXP Semiconductors S711E20E0VFNE2 Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 20KB OTP 52PLCC

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S711E20E0VFNE2
Detailed Description
IC MCU 8BIT 20KB OTP 52PLCC
Package
52-LCC (J-Lead)
Key Features
Package / Case: 52-LCC (J-Lead); Mounting Type: Surface Mount
Lifecycle Status
Last Time Buy
RoHS State
RoHS Compliant
Datasheet
S711E20E0VFNE2 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors S711E20E0VFNE2 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
768 x 8
Package / Case
52-LCC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
4.5V ~ 5.5V
Peripherals
POR, WDT
Number of I/O
38
Speed
2MHz
EEPROM Size
512 x 8
Core Processor
HC11
Alternate Parts Comparison (S711E20E0VFNE2 vs S908AS60AH3VFNE vs MC68HC11E0CFNE2R vs MCP11A1CFNE3R)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 52-LCC | 52-LCC | 52-LCC | 52-LCC |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V |
| Core Processor | HC11 | M68HC08 | HC11 | HC11 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 768 x 8 | 2K x 8 | 512 x 8 | 256 x 8 |
| Connectivity | SCI, SPI | CANbus, I²C, SCI, SPI | SCI, SPI | SCI, SPI |
| Data Converters | A/D 8x8b | A/D 15x8b SAR | A/D 8x8b | A/D 8x8b |
| Oscillator Type | Internal | External, Internal | Internal | External |
| Peripherals | POR, WDT | LVD, LVR, POR, PWM | POR, WDT | POR, WDT |
| Program Memory Type | OTP | Flash | ROMless | ROMless |
| Mounting Type | Surface Mount | -- | Surface Mount | Surface Mount |
| Action |
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