NXP Semiconductors MC68HC11E1CFNE3 Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT ROMLESS 52PLCC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC68HC11E1CFNE3
Detailed Description
IC MCU 8BIT ROMLESS 52PLCC
Package
52-LCC (J-Lead)
Key Features
Package / Case: 52-LCC (J-Lead); Mounting Type: Surface Mount
Lifecycle Status
Last Time Buy
RoHS State
RoHS Compliant
Datasheet
MC68HC11E1CFNE3 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC68HC11E1CFNE3 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
512 x 8
Package / Case
52-LCC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
4.5V ~ 5.5V
Peripherals
POR, WDT
Number of I/O
38
Speed
3MHz
EEPROM Size
512 x 8
Core Processor
HC11
Alternate Parts Comparison (MC68HC11E1CFNE3 vs MC68HC11E0CFNE2R vs MC68711E20CFNE3 vs MC68711E20CFNE2)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 52-LCC | 52-LCC | 52-LCC | 52-LCC |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V |
| Core Processor | HC11 | HC11 | HC11 | HC11 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 512 x 8 | 512 x 8 | 768 x 8 | 768 x 8 |
| Connectivity | SCI, SPI | SCI, SPI | SCI, SPI | SCI, SPI |
| Data Converters | A/D 8x8b | A/D 8x8b | A/D 8x8b | A/D 8x8b |
| Number of I/O | 38 | 38 | 38 | 38 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | POR, WDT | POR, WDT | POR, WDT | POR, WDT |
| Action |
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