NXP Semiconductors MCP11A1CFNE3R Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT ROMLESS 52PLCC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MCP11A1CFNE3R
Detailed Description
IC MCU 8BIT ROMLESS 52PLCC
Package
52-LCC (J-Lead)
Key Features
Package / Case: 52-LCC (J-Lead); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MCP11A1CFNE3R Datasheet
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Technical Specifications
NXP Semiconductors MCP11A1CFNE3R Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
HC11
RAM Size
256 x 8
Package / Case
52-LCC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
4.5V ~ 5.5V
Peripherals
POR, WDT
Number of I/O
38
Speed
3MHz
EEPROM Size
512 x 8
Alternate Parts Comparison (MCP11A1CFNE3R vs S908AS60AH3VFNE vs MC68HC11E0CFNE2R vs XC705B32CFNE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 52-LCC | 52-LCC | 52-LCC | 52-LCC |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V |
| Core Processor | HC11 | M68HC08 | HC11 | HC05 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 256 x 8 | 2K x 8 | 512 x 8 | 528 x 8 |
| Connectivity | SCI, SPI | CANbus, I²C, SCI, SPI | SCI, SPI | SCI |
| Data Converters | A/D 8x8b | A/D 15x8b SAR | A/D 8x8b | A/D 8x8b; D/A 2x8b |
| Oscillator Type | External | External, Internal | Internal | Internal |
| Peripherals | POR, WDT | LVD, LVR, POR, PWM | POR, WDT | POR, WDT |
| Program Memory Type | ROMless | Flash | ROMless | OTP |
| Mounting Type | Surface Mount | -- | Surface Mount | Surface Mount |
| Action |
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