NXP Semiconductors P87LPC764BN,112 Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 4KB OTP 20DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
P87LPC764BN,112
Detailed Description
Package
20-DIP (0.300", 7.62mm)
Key Features
Package / Case: 20-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
P87LPC764BN,112 Datasheet
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Technical Specifications
NXP Semiconductors P87LPC764BN,112 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Supplier Device Package
20-DIP
Peripherals
Brown-out Detect/Reset, LED, POR, WDT
Number of I/O
18
Speed
20MHz
Core Processor
8051
RAM Size
128 x 8
Program Memory Type
OTP
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