NXP Semiconductors P87LPC760BN,112 Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 1KB OTP 14DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
P87LPC760BN,112
Detailed Description
Package
14-DIP (0.300", 7.62mm)
Key Features
Package / Case: 14-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
P87LPC760BN,112 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors P87LPC760BN,112 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Supplier Device Package
14-DIP
Peripherals
Brown-out Detect/Reset, LED, POR, WDT
Number of I/O
12
Speed
20MHz
Core Processor
8051
RAM Size
128 x 8
Program Memory Type
OTP
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