NXP Semiconductors P80C32SBPN,112 Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT ROMLESS 40DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
P80C32SBPN,112
Detailed Description
Package
40-DIP (0.600", 15.24mm)
Key Features
Package / Case: 40-DIP (0.600", 15.24mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
P80C32SBPN,112 Datasheet
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Technical Specifications
NXP Semiconductors P80C32SBPN,112 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Through Hole
Package / Case
40-DIP (0.600", 15.24mm)
Supplier Device Package
40-DIP
Peripherals
POR
Number of I/O
32
Speed
16MHz
Core Processor
8051
RAM Size
256 x 8
Program Memory Type
ROMless
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