NXP Semiconductors MPC8358EZQADDDA Microcontroller, Microprocessor, FPGA Modules
IC MPU MPC83XX 266MHZ 668BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MPC8358EZQADDDA
Detailed Description
Package
668-BBGA Exposed Pad
Key Features
Package / Case: 668-BBGA Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MPC8358EZQADDDA Datasheet
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Technical Specifications
NXP Semiconductors MPC8358EZQADDDA Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
0°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
668-BBGA Exposed Pad
Supplier Device Package
668-PBGA-PGE (29x29)
Voltage IO
1.8V, 2.5V, 3.3V
Speed
266MHz
Core Processor
PowerPC e300
Number of Cores Bus Width
1 Core, 32-Bit
Co Processors DSP
Communications; QUICC Engine, Security; SEC
RAM Controllers
DDR, DDR2
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