NXP Semiconductors MPC755CPX350LE Microcontroller, Microprocessor, FPGA Modules
IC MPU MPC7XX 350MHZ 360FCPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MPC755CPX350LE
Detailed Description
Package
360-BBGA, FCBGA
Key Features
Package / Case: 360-BBGA, FCBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MPC755CPX350LE Datasheet
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Technical Specifications
NXP Semiconductors MPC755CPX350LE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
0°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
360-BBGA, FCBGA
Supplier Device Package
360-FCPBGA (25x25)
Voltage IO
2.5V, 3.3V
Speed
350MHz
Core Processor
PowerPC
Number of Cores Bus Width
1 Core, 32-Bit
Graphics Acceleration
No
Series
MPC7xx
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