NXP Semiconductors MPC562MZP66 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 388PBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MPC562MZP66
Detailed Description
Package
388-BBGA
Key Features
Package / Case: 388-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MPC562MZP66 Datasheet
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Technical Specifications
NXP Semiconductors MPC562MZP66 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
388-BBGA
Supplier Device Package
388-PBGA (27x27)
Peripherals
POR, PWM, WDT
Number of I/O
64
Speed
66MHz
Core Processor
PowerPC
RAM Size
32K x 8
Program Memory Type
ROMless
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