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NXP Semiconductors MPC555LFMZP40 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 448KB FLASH 272PBGA

504NXP Semiconductors272-BBGARoHS
MPC555LFMZP40 - No Image Available

Same model may have multiple batches, images only for reference.

MPC555LFMZP40
Manufacturer
Part Number (MPN)
MPC555LFMZP40
Detailed Description
Package
272-BBGA
Key Features
Package / Case: 272-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
PDF MPC555LFMZP40 Datasheet
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Technical Specifications

NXP Semiconductors MPC555LFMZP40 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
272-BBGA
Supplier Device Package
272-PBGA (27x27)
Peripherals
POR, PWM, WDT
Number of I/O
101
Speed
40MHz
Core Processor
PowerPC
RAM Size
26K x 8
Program Memory Type
Flash

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