NXP Semiconductors MPC5553MZP132 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 1.5MB FLASH 416PBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MPC5553MZP132
Detailed Description
Package
416-BBGA
Key Features
Package / Case: 416-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MPC5553MZP132 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MPC5553MZP132 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
416-BBGA
Supplier Device Package
416-PBGA (27x27)
Peripherals
DMA, POR, PWM, WDT
Number of I/O
220
Speed
132MHz
Core Processor
e200z6
RAM Size
64K x 8
Program Memory Type
Flash
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.