NXP Semiconductors MPC5517GAVMG80 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32B 1.5MB FLASH 208MAPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MPC5517GAVMG80
Detailed Description
Package
208-BGA
Key Features
Package / Case: 208-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MPC5517GAVMG80 Datasheet
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Technical Specifications
NXP Semiconductors MPC5517GAVMG80 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
208-BGA
Supplier Device Package
208-BGA (17x17)
Peripherals
DMA, POR, PWM, WDT
Number of I/O
144
Speed
80MHz
Core Processor
e200z1
RAM Size
80K x 8
Program Memory Type
Flash
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