NXP Semiconductors MK26FN2M0CAC18R Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 2MB FLASH 169WLCSP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MK26FN2M0CAC18R
Detailed Description
Package
169-UFBGA, WLCSP
Key Features
Package / Case: 169-UFBGA, WLCSP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MK26FN2M0CAC18R Datasheet
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Technical Specifications
NXP Semiconductors MK26FN2M0CAC18R Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
169-UFBGA, WLCSP
Supplier Device Package
169-WLCSP (5.5x5.63)
Peripherals
DMA, I²S, LVD, POR, PWM, WDT
Number of I/O
116
Speed
180MHz
Core Processor
ARM® Cortex®-M4
RAM Size
256K x 8
Program Memory Type
Flash
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