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NXP Semiconductors MFS8611BMBA0ESR2 Power Management - Specialized

SAFETY SYSTEM BASIS CHIP FOR DOM

1,491 ActiveNXP Semiconductors48-VFQFN Exposed PadRoHS
MFS8611BMBA0ESR2 - No Image Available

Same model may have multiple batches, images only for reference.

MFS8611BMBA0ESR2
Manufacturer
Part Number (MPN)
MFS8611BMBA0ESR2
Detailed Description
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount, Wettable Flank
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
PDF MFS8611BMBA0ESR2 Datasheet
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Technical Specifications

NXP Semiconductors MFS8611BMBA0ESR2 Power Management - Specialized technical specifications.

General

Application
Camera
Package / Case
48-VFQFN Exposed Pad
Series
Automotive, AEC-Q100
Mounting Type
Surface Mount, Wettable Flank
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
60V

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