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NXP Semiconductors MFS2633AMDA0AD Power Management - Specialized

SAFETY SYSTEM BASIS CHIP WITH LO

4,404 ActiveNXP Semiconductors48-LQFP Exposed PadRoHS
MFS2633AMDA0AD - No Image Available

Same model may have multiple batches, images only for reference.

MFS2633AMDA0AD
Manufacturer
Part Number (MPN)
MFS2633AMDA0AD
Detailed Description
Package
48-LQFP Exposed Pad
Key Features
Package / Case: 48-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
PDF MFS2633AMDA0AD Datasheet
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Technical Specifications

NXP Semiconductors MFS2633AMDA0AD Power Management - Specialized technical specifications.

General

Operating Temperature
-40°C ~ 125°C (TA)
Application
System Basis Chip
Mounting Type
Surface Mount
Package / Case
48-LQFP Exposed Pad
Current Supply
29µA
Supplier Device Package
48-LQFP-EP (7x7)
Supply Voltage
3.2V ~ 40V
Series
Automotive, AEC-Q100

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