NXP Semiconductors MCF54453VP266 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 360TEPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MCF54453VP266
Detailed Description
Package
360-BBGA
Key Features
Package / Case: 360-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MCF54453VP266 Datasheet
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Technical Specifications
NXP Semiconductors MCF54453VP266 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Surface Mount
Package / Case
360-BBGA
Supplier Device Package
360-BGA (23x23)
Peripherals
DMA, WDT
Number of I/O
132
Speed
266MHz
Core Processor
Coldfire V4
RAM Size
32K x 8
Program Memory Type
ROMless
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