NXP Semiconductors MCF5307CAI66B Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 208FQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MCF5307CAI66B
Detailed Description
Package
208-BFQFP
Key Features
Package / Case: 208-BFQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MCF5307CAI66B Datasheet
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Technical Specifications
NXP Semiconductors MCF5307CAI66B Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
208-BFQFP
Supplier Device Package
208-FQFP (28x28)
Peripherals
DMA, POR, WDT
Number of I/O
16
Speed
66MHz
Core Processor
Coldfire V3
RAM Size
4K x 8
Program Memory Type
ROMless
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