NXP Semiconductors MCF5275LCVM166J Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 196MAPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MCF5275LCVM166J
Detailed Description
Package
196-LBGA
Key Features
Package / Case: 196-LBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MCF5275LCVM166J Datasheet
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Technical Specifications
NXP Semiconductors MCF5275LCVM166J Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
196-LBGA
Supplier Device Package
196-LBGA (15x15)
Peripherals
DMA, WDT
Number of I/O
61
Speed
166MHz
Core Processor
Coldfire V2
RAM Size
64K x 8
Program Memory Type
ROMless
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