NXP Semiconductors MCF5208CAB166 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 160QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MCF5208CAB166
Detailed Description
Package
160-BQFP
Key Features
Package / Case: 160-BQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MCF5208CAB166 Datasheet
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Technical Specifications
NXP Semiconductors MCF5208CAB166 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
160-BQFP
Supplier Device Package
160-QFP (28x28)
Peripherals
DMA, WDT
Number of I/O
50
Speed
166.67MHz
Core Processor
Coldfire V2
RAM Size
16K x 8
Program Memory Type
ROMless
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