NXP Semiconductors MC9S08SH8CPJ Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 8KB FLASH 20DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08SH8CPJ
Detailed Description
Package
20-DIP (0.300", 7.62mm)
Key Features
Package / Case: 20-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MC9S08SH8CPJ Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC9S08SH8CPJ Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Supplier Device Package
20-DIP
Peripherals
LVD, POR, PWM, WDT
Number of I/O
17
Speed
40MHz
Core Processor
S08
RAM Size
512 x 8
Program Memory Type
Flash
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.