NXP Semiconductors MC9S08PA4AMSC Microcontroller, Microprocessor, FPGA Modules
8-BIT 5V FULL-FEATURED MCU WITH
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08PA4AMSC
Detailed Description
Package
8-SOIC (0.154", 3.90mm Width)
Key Features
Package / Case: 8-SOIC (0.154", 3.90mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MC9S08PA4AMSC Datasheet
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Technical Specifications
NXP Semiconductors MC9S08PA4AMSC Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Supplier Device Package
8-SOIC
Peripherals
LVD, POR, PWM, WDT
Number of I/O
6
Speed
20MHz
EEPROM Size
128 x 8
Core Processor
S08
RAM Size
512 x 8
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