NXP Semiconductors MC68HC908JB8JP Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 8KB FLASH 20DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC68HC908JB8JP
Detailed Description
Package
20-DIP (0.300", 7.62mm)
Key Features
Package / Case: 20-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MC68HC908JB8JP Datasheet
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Technical Specifications
NXP Semiconductors MC68HC908JB8JP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Supplier Device Package
20-DIP
Peripherals
LVD, POR, PWM
Number of I/O
13
Speed
3MHz
Core Processor
HC08
RAM Size
256 x 8
Program Memory Type
Flash
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