NXP Semiconductors MC68HC705J1ACP Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 1.2KB OTP 20DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC68HC705J1ACP
Detailed Description
Package
20-DIP (0.300", 7.62mm)
Key Features
Package / Case: 20-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MC68HC705J1ACP Datasheet
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Technical Specifications
NXP Semiconductors MC68HC705J1ACP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Supplier Device Package
20-DIP
Peripherals
POR, WDT
Number of I/O
14
Speed
4MHz
Core Processor
HC05
RAM Size
64 x 8
Program Memory Type
OTP
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