NXP Semiconductors MC68HC16Z1CEH25 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT ROMLESS 132PQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC68HC16Z1CEH25
Detailed Description
Package
132-BQFP Bumpered
Key Features
Package / Case: 132-BQFP Bumpered; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
MC68HC16Z1CEH25 Datasheet
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Technical Specifications
NXP Semiconductors MC68HC16Z1CEH25 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
132-BQFP Bumpered
Supplier Device Package
132-PQFP (24.13x24.13)
Peripherals
POR, PWM, WDT
Number of I/O
16
Speed
25MHz
Core Processor
CPU16
RAM Size
1K x 8
Program Memory Type
ROMless
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