NXP Semiconductors MC33HB2000EKR2 Full, Half-Bridge Drivers
H-BRIDGE SPI BRUSHED DC MOTOR
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC33HB2000EKR2
Detailed Description
Package
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Key Features
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MC33HB2000EKR2 Datasheet
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Technical Specifications
NXP Semiconductors MC33HB2000EKR2 Full, Half-Bridge Drivers technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TJ)
Features
Charge Pump, Slew Rate Controlled, Status Flag
Mounting Type
Surface Mount
Package / Case
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Technology
Power MOSFET
Interface
Logic, PWM, SPI
Supplier Device Package
32-SOIC-EP
Supply Voltage
3.3V ~ 5V
Current Output Channel
3A
Current Peak Output
16A
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