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NXP Semiconductors LPC802M001JHI33Y Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 16KB FLASH 33HVQFN

7,200 ActiveNXP Semiconductors32-VFQFN Exposed PadRoHS
LPC802M001JHI33Y - No Image Available

Same model may have multiple batches, images only for reference.

LPC802M001JHI33Y
Manufacturer
Part Number (MPN)
LPC802M001JHI33Y
Detailed Description
Package
32-VFQFN Exposed Pad
Key Features
Package / Case: 32-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
PDF LPC802M001JHI33Y Datasheet
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Technical Specifications

NXP Semiconductors LPC802M001JHI33Y Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
32-VFQFN Exposed Pad
Supplier Device Package
32-HVQFN (5x5)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
17
Speed
15MHz
Core Processor
ARM® Cortex®-M0+
RAM Size
2K x 8
Program Memory Type
Flash

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