NXP Semiconductors LPC55S66JBD64Y Microcontroller, Microprocessor, FPGA Modules
HIGH EFFICIENCY ARM CORTEX -M33
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC55S66JBD64Y
Detailed Description
Package
64-TQFP Exposed Pad
Key Features
Package / Case: 64-TQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC55S66JBD64Y Datasheet
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Technical Specifications
NXP Semiconductors LPC55S66JBD64Y Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad
Supplier Device Package
64-HTQFP (10x10)
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O
36
Speed
150MHz
Core Processor
ARM® Cortex®-M33
RAM Size
144K x 8
Program Memory Type
Flash
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