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NXP Semiconductors LPC5536JBD64MP Microcontroller, Microprocessor, FPGA Modules

ARM CORTEX-M33-BASED MICROCONTRO

4,482 ActiveNXP Semiconductors64-TQFP Exposed PadRoHS
LPC5536JBD64MP - No Image Available

Same model may have multiple batches, images only for reference.

LPC5536JBD64MP
Manufacturer
Part Number (MPN)
LPC5536JBD64MP
Detailed Description
Package
64-TQFP Exposed Pad
Key Features
Package / Case: 64-TQFP Exposed Pad
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
PDF LPC5536JBD64MP Datasheet
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Technical Specifications

NXP Semiconductors LPC5536JBD64MP Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Package / Case
64-TQFP Exposed Pad
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Speed
150MHz
Connectivity
CANbus, I²C, SPI, UART/USART
Operating Temperature
-40°C ~ 105°C (TA)
Core Processor
ARM® Cortex®-M33
RAM Size
128K x 8
Numberof IO
39
Program Memory Type
Flash
Core Size
32-Bit

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