NXP Semiconductors LPC5512JBD64E Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 64KB FLASH 64HTQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC5512JBD64E
Detailed Description
Package
64-TQFP Exposed Pad
Key Features
Package / Case: 64-TQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC5512JBD64E Datasheet
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Technical Specifications
NXP Semiconductors LPC5512JBD64E Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad
Supplier Device Package
64-HTQFP (10x10)
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O
36
Speed
150MHz
Core Processor
ARM® Cortex®-M33
RAM Size
48K x 8
Program Memory Type
Flash
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