NXP Semiconductors LPC54605J256ET180E Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 256KB FLSH 180TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC54605J256ET180E
Detailed Description
Package
180-TFBGA
Key Features
Package / Case: 180-TFBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC54605J256ET180E Datasheet
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Technical Specifications
NXP Semiconductors LPC54605J256ET180E Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
180-TFBGA
Supplier Device Package
180-TFBGA (12x12)
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O
145
Speed
180MHz
EEPROM Size
16K x 8
Core Processor
ARM® Cortex®-M4
RAM Size
136K x 8
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