NXP Semiconductors LPC2939FBD208,551 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16/32B 768KB FLSH 208LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC2939FBD208,551
Detailed Description
Package
208-LQFP
Key Features
Package / Case: 208-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
LPC2939FBD208,551 Datasheet
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Technical Specifications
NXP Semiconductors LPC2939FBD208,551 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
208-LQFP
Supplier Device Package
208-LQFP (28x28)
Peripherals
DMA, POR, PWM, WDT
Number of I/O
152
Speed
125MHz
EEPROM Size
16K x 8
Core Processor
ARM9®
RAM Size
56K x 8
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