NXP Semiconductors LPC2930FBD208,551 Microcontroller, Microprocessor, FPGA Modules
LPC2900 - Arm9, 32-Bit RISC Micr
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC2930FBD208,551
Detailed Description
Package
208-LQFP
Key Features
Package / Case: 208-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC2930FBD208,551 Datasheet
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Technical Specifications
NXP Semiconductors LPC2930FBD208,551 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
208-LQFP
Supplier Device Package
208-LQFP (28x28)
Peripherals
DMA, POR, PWM, WDT
Number of I/O
152
Speed
125MHz
Core Processor
ARM968E-S
RAM Size
56K x 8
Program Memory Type
ROMless
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