NXP Semiconductors LPC2368FBD100,518 Microcontroller, Microprocessor, FPGA Modules
ARM7 WITH 512 KB FLASH, 58 KB SR
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC2368FBD100,518
Detailed Description
Package
100-LQFP
Key Features
Package / Case: 100-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC2368FBD100,518 Datasheet
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Technical Specifications
NXP Semiconductors LPC2368FBD100,518 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP
Supplier Device Package
100-LQFP (14x14)
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
70
Speed
72MHz
Core Processor
ARM7TDMI-S
RAM Size
58K x 8
Program Memory Type
Flash
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